We offer production of ready projects up to ready device including:
- Assembly of boards and soldering of SMT components with solder paste or glue, single or double sided.
- DIP and POP assembly
- Automatic optical inspection AOI
- Wave soldering of SMT and TH components
- Manual placing and soldering of components that are not designed for automated placing.
- Mechanical and final assembly
- Treatment of cables and cable forms
- PCB design
- Consultations and optimizations